Agendas & Partners - India Electronics Conclave 2026
Karnataka Electronics Leadership Summit
Wednesday, 16 September 2026
11 am–4 pm, Gulmohar Hall
Karnataka: A Powerhouse in Electronics Manufacturing
Partner: PwC India
Sponsor: Bosch Manufacturing Solutions
with Dr. Klaus-Peter Proll, Global Business Cluster Owner - Sensors & Electronics , Bosch Manufacturing Solutions
eFuture Conference
Wednesday, 16 September 2026
11 am–4:45 pm, Jacaranda Hall
Catalyzing the Next Wave of Intelligent Electronics
Partners: Avanteum & Aravind Consultancy
Sponsors: Embed UR, SEALSQ, ST Micro, NXP
| Session / Topic | Speakers |
|---|---|
Inaugural Session | Niju Vijayan, Avanteum Advisors LLP; Bhaskar Kanchi, embedUR Systems; Lars Reger, NXP |
The New Edge Order: Redefining Embedded Systems for an AI-First World | Sridhar GS, Outdu Mediatech |
Panel Discussion: Embedded Electronics in the Age of AI — New Architectures, New Constraints, New Opportunities | Shekhar Sanyal, Myelin Foundry; Prof. Anandi Giridharan, IISc Bangalore; Sundar Vanchinathan, SiTime |
The Emerging Power Paradigm: Rewiring the Future of Power Electronics | Ro Chawla, ST Micro |
Panel Discussion: Advanced Power Electronics for a Smarter Energy Future — Driving Adoption to Accelerate Scale | Dr. S J Dhinagar, Ola Electric; Amit, L&T; Muthukrishnan Chinnasamy, Zaikenn; Harsha Venkatesh, Zepco |
Always On, Always Connected: The New Connectivity Landscape | |
Session Keynote Address: Securing IoT in the Age of AI and Quantum Computing | Fabien Treillaud, SEALSQ |
Panel Discussion: The Living Network — Weaving Together the Disconnected World | Raghavan Sampath (Moderator), Mediatek; Nagaraj, Melange System; Vinay Solanki, Elecbits; Ranjit Dash, Realtek |
The Net-Zero Catalyst: Engineering the Next Era of Green Electronics | Edoardo Auteri, STMicroelectronics; Niju Vijayan, Avanteum Advisors LLP; Bhaktha Keshavachar; Wilma Rodrigues, Saahas |
CEO Forum
Wednesday, 16 September 2026
10:30 am– 3:15 pm, Cassia Hall
Beyond Manufacturing: India's Bid for Design, IP and Component Ownership — ECMS Scheme: A Catalyst for Self-Reliance & Value Addition
Partner: ELCINA (Electronic Industries Association of India)
Sponsor: Kyocera
Panel Discussion I: Gaining Traction for the Global Value Chain — Excellence in Components, Modules and Equipment
Panel Discussion II: Key Elements for Capacity Building — Enabling Critical Inputs for Self-Reliance
ICEA Capital Goods Summit
Thursday, 17 September, 2026
11 am–1 pm, Gulmohar Hall
Powering Electronics Manufacturing: Capital Goods, Robotics & Automation Ecosystem
Localising the machines, automation systems and testing infrastructure that power India's electronics factories
Partner: ICEA (India Cellular & Electronics Association)
Session 1: Capital Goods and Automation for Electronics Manufacturing: Localisation, Technology & Ecosystem Readiness
Session 2: Building India's Electronics Components Ecosystem: Leap towards Domestic Value-Addition
Moderator: Ronak Pol, Foundation for Economic Development
Panelists: N.P. Sridhar, Titan Engineering & Automation (TEAL); Josh Foulger, Padget Electronics – Dixon Technologies; Soni Saran Singh, NMTronics India; Dr. Nagahanumaiah, CMTI Bengaluru; Dr. Aashish Saurikhia, ICEA
Exports & FTAs – Electronics Sector
Thursday, 17 September 2026
11 am–1 pm, Jacaranda Hall
Understanding FTAs, Claiming Benefits and Handling Non-Tariff Barriers for the Electronics Sector
Partner: Mobile & Electronic Devices Export Promotion Council (MEDEPC)
Speakers: Desh Raj Bhadana, Director MEDEPC; Anushka Sikka, Manager, Research & Trade Policy, MEDEPC
Session 1: Understanding FTAs and Leveraging them for Business Growth
Session 2: Identifying Opportunities for Electronics Sector — Specific Gains Across FTAs for Specific Tariff Lines
Session 3: How to Claim FTA Benefits? (Rules of Origin, Documentation and Certification)
Session 4: Handling Non-Tariff Barriers and Compliance Issues in FTA Markets
BPCA Tech Conference
Thursday, 17 September 2026
10:30 am– 3:15 pm, Cassia Hall
India PCB 2.0: Catalysed by ECMS Scheme; Driven by Surging Demand
Partners: BPCA (Bharat's Platform for Printed Circuits and Assemblies); ELCINA (Electronic Industries Association of India)
Panel Discussion I: Challenges in Meeting Demand of US$11 Bn by 2030
Panel Discussion II: Establishing Key Pillars for PCB Industry — Supply Chain, Equipment, Technology & R&D
OE-A Symposium
Thursday, 17 September 2026
2 pm–onwards, Jacaranda Hall
Flexible and Printed Electronics: From Technology to Smart Applications
Partners: VDMA (OE-A)
| Session / Topic | Speakers |
|---|---|
Inaugural Session | Sandip Roy, General Manager VDMA India |
Flexible and Printed Electronics: Products, Markets and Technologies | Dr. Klaus Hecker, Managing Director OE-A |
30 Years Plus of Pragmatic Innovation with Printed Electronics | Dr. Alain Schumacher, Chief Technology Officer, IEE S.A. |
Industrializing Printed Electronics | Mr. Matjaž Finžgar, Key Account Manager, INO d.o.o. |
One Source for Smart Integrated Solutions: Mastering innovative Value-Chains | Dr. Carsten L. Herzhoff, Managing Director & CTO/COO, Lohmann GmbH & Co. KG |
Roll-to-Roll manufacturing of Wearables and IoT sensors for an AI-driven society | Mr. Raghu Pendyala, Co-founder and COO, TracXon B.V. |
Inkjet Printing of Particle Free Silver Ink on PET Films | Prof. Ulrich Moosheimer, Professor for Printing Technology and Innovation, Hochschule München |
Smart Sensor systems for Healthcare, industry 5.0 and energy management | Prof. Inès Chihi, Associate Professor, University of Luxembourg |
When Every Micron Counts: Ultra-Precise Printing for Displays, Sensors and Advanced Packaging | Dr. Witold Nawrot, Strategic Partnerships Lead, XTPL S.A. |
IEEE Standards Workshop
Friday, 18 September 2026
11 am–1 pm, Parijatha Hall
The Future of EDA: IEEE Standards in Action
Partners: IEEE
| Session / Topic | Speakers |
|---|---|
Welcome Address — opening remarks on the IEEE SA ecosystem's goals, 2026 initiatives and strategies to increase local standard-making engagement | Vinayak G Kamath, Corporate Engagement Manager, IEEE |
IEEE CEDA Bangalore Activities Solving Industry Interoperability Gaps — the local EDA/VLSI ecosystem's 2026 initiatives, and how academic research and next-gen designs can integrate into standard EDA tools | Sajal Mittal, IEEE CEDA Bangalore Chair, Senior Member IEEE, Associate Director, Samsung Semiconductor India Research, Bengaluru |
A Beginner's Guide to IEEE P1801 UPF Standards — foundational overview of the UPF standard for low-power design, its use in a real-world design flow, and its role in energy-efficient electronics | Raguvaran Eswaran, Senior Member IEEE, Silicon Domain Architect, Intel Technology India Pvt Ltd |
Technical Track: Advanced Low-Power & Analog/Mixed-Signal Verification Standards — a deep-dive into standardizing design-to-verification methodologies (IEEE 1800 / SV-AMS) | Lakshmanan Balasubramanian, Senior Member IEEE, Consultant Semiconductor IC Technologist |
Closing Remarks — summary of key insights and professional growth avenues via standards working groups | Vinayak G Kamath, Corporate Engagement Manager, IEEE |
Engineering for Tomorrow: Design to Manufacturing
Friday, 18 September 2026
11 am–1 pm, Cassia Hall
Next-Gen PCB Design: From Design to Manufacturability
Partners: Sienna Ecad Technologies (An Avalon Group Company)
Speakers: Savita Ganjigatti, Sr. Vice President, Engineering and Operations, Sienna Ecad Technologies (An Avalon Group Company)
Keynote: Engineering for Tomorrow — Design to Manufacturing
Panel Discussion: Industry Case Study